Experimental vacuum plasma equipment

Experimental vacuum plasma equipment

Experimental vacuum plasma equipment

Number

Project

Technical Parameter

1

Specifications of the whole machine

650mm(W) ×550mm(D)×450mm(H)

2

Vacuum chamber specifications

Imported aluminum200(W) ×200(H)×250(D)mm,10L

3

Electrode plate specifications

Specialized aluminum electrode150(L) × 150(W)mm

4

vacuum pump system

Mechanical rotary vane vacuum pump (external)

5

Vacuum measurement system

Pirani resistance vacuum gauge

6

Gas metering system

Adjustable float flow meter

7

Number of gas pathways

2 channels intake, 1 way venting

8

Plasma generator

40KHz,High frequency generator, 0-1000W adjustable

9

Working gas

2 working gas options available:Ar2、N2、H2、O2

Features

1. High precision, fast response, good handling and compatibility, complete functions and professional technical support;

2. It is suitable for surface cleaning and activation of small products in university laboratories and semiconductor IC fields.

Industry

It is suitable for cameras and industries, mobile phone manufacturing, semiconductor IC fields, silica gel, plastics, polymer fields, automotive electronics industry, aviation industry, etc.

Application

1. Camera and fingerprint recognition industry: Oxidation removal on the surface of the gold PAD of the soft hard bonding board; IR surface cleaning and cleansing;

2. In the field of semiconductor ICs, COB, COG, COF, ACF processes are used for cleaning before wire bonding and soldering;

3. Silicone, plastic, and polymer fields: Surface roughening, etching, and activation of silicone, plastic, and polymer.

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