Experimental vacuum plasma equipment
|
Number |
Project |
Technical Parameter |
|
1 |
Specifications of the whole machine |
650mm(W) ×550mm(D)×450mm(H) |
|
2 |
Vacuum chamber specifications |
Imported aluminum200(W) ×200(H)×250(D)mm,10L |
|
3 |
Electrode plate specifications |
Specialized aluminum electrode150(L) × 150(W)mm |
|
4 |
vacuum pump system |
Mechanical rotary vane vacuum pump (external) |
|
5 |
Vacuum measurement system |
Pirani resistance vacuum gauge |
|
6 |
Gas metering system |
Adjustable float flow meter |
|
7 |
Number of gas pathways |
2 channels intake, 1 way venting |
|
8 |
Plasma generator |
40KHz,High frequency generator, 0-1000W adjustable |
|
9 |
Working gas |
2 working gas options available:Ar2、N2、H2、O2 |
|
Features |
1. High precision, fast response, good handling and compatibility, complete functions and professional technical support; 2. It is suitable for surface cleaning and activation of small products in university laboratories and semiconductor IC fields. |
|
|
Industry |
It is suitable for cameras and industries, mobile phone manufacturing, semiconductor IC fields, silica gel, plastics, polymer fields, automotive electronics industry, aviation industry, etc. |
|
|
Application |
1. Camera and fingerprint recognition industry: Oxidation removal on the surface of the gold PAD of the soft hard bonding board; IR surface cleaning and cleansing; 2. In the field of semiconductor ICs, COB, COG, COF, ACF processes are used for cleaning before wire bonding and soldering; 3. Silicone, plastic, and polymer fields: Surface roughening, etching, and activation of silicone, plastic, and polymer. |
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